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3,474 results for “Electron”
IODP Expedition 366 Scanning electron microscope images
<p>Microscopic images of discrete samples were acquired using a scanning electron microscope (SEM) and captured as image files. These files were uploaded along with a brief description and a record of the microscopic conditions when the image was taken.</p>
FIGURES 5 6. Pieza heads, scanning electron micrographs. 5 in Pieza, a new genus of microbombyliids from the New World (Diptera: Mythicomyiidae)
FIGURES 5 6. Pieza heads, scanning electron micrographs. 5. Pieza angusta (Melander). 6. Pieza sinclairi, sp. nov.
ultraLM and miniLM: Locator tools for smart tracking of fluorescent cells in correlative light and electron microscopy
<p>Data for submission to Wellcome Open Research entitled "ultraLM and miniLM: Locator tools for smart tracking of fluorescent cells in correlative light and electron microscopy".</p> <p>Data_ultraLM.tif is an image stack from the fluorescence microscope mounted on the ultramicrotome.</p> <p>Data_miniLM.tif is an image stack from the fluorescence microscope mounted in the SBF-SEM.</p> <p>Data_miniLM_EM.tif is an image stack from the SBF-SEM while the miniLM was in-situ.</p>
Explaining non-adoption of electronic government services by citizens. A study among non-users of public e-services in Latvia
<p>This data was collected as part of the H2020 Citadel project, http://www.citadel-h2020.eu, project no. 726755. The objective was to analyse citizen motives for not using electronic government services. Using interviews among users of Citizens´ Service Centres in Latvia, the data is used to analyses the motives of citizens not to use electronic government services but to rely on non-electronic equivalents or on in-person assistance. Findings and fieldwork details are available in D2.1 of this project.</p>
Dataset to accompany publication "Distinguishing Inner and Outer-Sphere Hot Electron Transfer in Au/p-GaN Photocathodes"
<p>This dataset accompanies the publication "Distinguishing Inner and Outer-Sphere Hot Electron Transfer in Au/p-GaN Photocathodes" published in Nano Letters. The data can be used to reproduce the original plots in figures 2-4 in the main text and all original plots in figures S1-S13 in the supporting information. All files are in .xlsx and easily readable. <br>The abstract for the associated paper is as follows:<br>Exploring nonequilibrium hot carriers from plasmonic metal nanostructures is a dynamic field in optoelectronics, with applications including photochemical reactions for solar fuel generation. The hot carrier injection mechanism and the reaction rate are highly impacted by the metal/molecule interaction. However, determining the primary type of the reaction and thus the injection mechanism of hot carriers has remained elusive. In this work, we reveal an electron injection mechanism deviating from a purely outer-sphere process for the reduction of ferricyanide redox molecule in a gold/p-type gallium nitride (Au/p-GaN) photocathode system. Combining our experimental approach with ab-initio simulations, we discover that an efficient inner-sphere transfer of low-energy electrons leads to an enhancement in the photocathode device performance in the interband regime. These findings provide important mechanistic insights, showing our methodology as a powerful tool for analyzing and engineering hot-carrier-driven processes in plasmonic photocatalytic systems and optoelectronic devices.</p>
Supporting Information for "Electron and proton peak intensities as observed by a five-spacecraft fleet in solar cycle 25"
<p>Table of parameters employed in the study "Electron and proton peak intensities as observed by a five-spacecraft fleet in solar cycle 25". The table contains the original peak intensities directly taken from the <em>SERPENTINE SEP event catalog</em>, without any scaling or inter-calibration factors that are applied in the study. All information provided in the table is based on the <em>SERPENTINE SEP event catalog</em> and <em>SERPENTINE CME and coronal shocks catalog</em><strong>,</strong> only limiting the variables to those used in this study. The dataset is in CSV format.</p> <p>For more information, and if you use this table, please refer to the corresponding publication:</p> <blockquote> <div> <p>Electron and proton peak intensities as observed by a five-spacecraft fleet in solar cycle 25<br>G. U. Farwa, N. Dresing, J. Gieseler, L. Vuorinen, I. G. Richardson, C. Palmroos, S. Valkila, B. Heber, S. Jensen, P. Kühl, L. Rodríguez-García and R. Vainio<br>A&A, 693 (2025) A198<br>DOI: <a href="https://doi.org/10.1051/0004-6361/202450945">10.1051/0004-6361/202450945</a></p> </div> </blockquote> <div> <div> </div> </div> <p><strong>Field descriptions</strong></p> <ul> <li>id: ID</li> <li>date: Event date [UTC]</li> <li>flare_time: Flare time [UTC]</li> <li>flare_lat: Flare Carrington latitude [deg]</li> <li>flare_lon: Flare Carrington longitude [deg]</li> <li>flare_class: Flare class (GOES)</li> <li>flare_comments: Flare Comments</li> <li>radio_type2: Radio type II bursts</li> <li>decametric_type2_start: Decametric type II burst start time [UT]</li> <li>decametric_type2_stop: Decametric type II burst end time [UT]</li> <li>radio_type2_start: Metric radio type II burst start time [UT]</li> <li>radio_type2_stop: Metric radio type II burst end time [UT]</li> <li>solar_mach_link: Solar-Mach link</li> <li>S/C codes <ul> <li>BepiC: BepiColombo</li> <li>L1: L1 (SOHO/Wind)</li> <li>PSP: Parker Solar Probe</li> <li>STA: STEREO A</li> <li>SolO: Solar Orbiter</li> </ul> </li> <li>S/C related field descriptions <ul> <li>{sc}_sc_lat: S/C Carrington latitude [deg]</li> <li>{sc}_sc_lon: S/C Carrington longitude [deg]</li> <li>{sc}_dist: S/C radial distance [au]</li> <li>{sc}_p25MeV_onset_date: S/C protons 25 MeV onset date [UTC]</li> <li>{sc}_p25MeV_onset_time: S/C protons 25 MeV onset time [UTC]</li> <li>{sc}_p25MeV_onset_time_formatted: S/C protons 25 MeV onset time [UTC] (Formatted)</li> <li>{sc}_p25MeV_onset_averaging: S/C protons 25 MeV averaging used for onset [min]</li> <li>{sc}_p25MeV_onset_sector: S/C protons 25 MeV sector used for onset</li> <li>{sc}_p25MeV_peak_date: S/C protons 25 MeV peak date [UTC]</li> <li>{sc}_p25MeV_peak_time: S/C protons 25 MeV peak time [UTC]</li> <li>{sc}_p25MeV_peak_time_formatted: S/C protons 25 MeV peak time [UTC] (Formatted)</li> <li>{sc}_p25MeV_peak_flux: S/C protons 25 MeV original peak flux [cm^-2 s^-1 sr^-1 MeV^-1]</li> <li>{sc}_p25MeV_peak_flux_formatted: S/C protons 25 MeV original peak flux [cm^-2 s^-1 sr^-1 MeV^-1] (Formatted)</li> <li>{sc}_p25MeV_peak_averaging: S/C protons 25 MeV averaging used for peak [min]</li> <li>{sc}_p25MeV_peak_sector: S/C protons 25 MeV sector used for peak</li> <li>{sc}_p25MeV_injection_date: S/C protons 25 MeV inferred injection date [UTC]</li> <li>{sc}_p25MeV_injection_time: S/C protons 25 MeV inferred injection time [UTC]</li> <li>{sc}_p25MeV_sw_speed: S/C protons 25 MeV onset solar wind speed [km/s]</li> <li>{sc}_p25MeV_comments: S/C protons 25 MeV comments</li> <li>{sc}_e100keV_onset_date: S/C electrons 100 keV onset date [UTC]</li> <li>{sc}_e100keV_onset_time: S/C electrons 100 keV onset time [UTC]</li> <li>{sc}_e100keV_onset_time_formatted: S/C electrons 100 keV onset time [UTC] (Formatted)</li> <li>{sc}_e100keV_onset_averaging: S/C electrons 100 keV averaging used for onset [min]</li> <li>{sc}_e100keV_onset_sector: S/C electrons 100 keV sector used for onset</li> <li>{sc}_e100keV_peak_date: S/C electrons 100 keV peak date [UTC]</li> <li>{sc}_e100keV_peak_time: S/C electrons 100 keV peak time [UTC]</li> <li>{sc}_e100keV_peak_time_formatted: S/C electrons 100 keV peak time [UTC] (Formatted)</li> <li>{sc}_e100keV_peak_flux: S/C electrons 100 keV original peak flux [cm^-2 s^-1 sr^-1 MeV^-1]</li> <li>{sc}_e100keV_peak_flux_formatted: S/C electrons 100 keV original peak flux [cm^-2 s^-1 sr^-1 MeV^-1] (Formatted)</li> <li>{sc}_e100keV_peak_averaging: S/C electrons 100 keV averaging used for peak [min]</li> <li>{sc}_e100keV_peak_sector: S/C electrons 100 keV sector used for peak</li> <li>{sc}_e100keV_injection_date: S/C electrons 100 keV inferred injection date [UTC]</li> <li>{sc}_e100keV_injection_time: S/C electrons 100 keV inferred injection time [UTC]</li> <li>{sc}_e100keV_sw_speed: S/C electrons 100 keV onset solar wind speed [km/s]</li> <li>{sc}_e100keV_comments: S/C electrons 100 keV comments</li> <li>{sc}_e1MeV_onset_date: S/C electrons 1 MeV onset date [UTC]</li> <li>{sc}_e1MeV_onset_time: S/C electrons 1 MeV onset time [UTC]</li> <li>{sc}_e1MeV_onset_time_formatted: S/C electrons 1 MeV onset time [UTC] (Formatted)</li> <li>{sc}_e1MeV_onset_averaging: S/C electrons 1 MeV averaging used for onset [min]</li> <li>{sc}_e1MeV_onset_sector: S/C electrons 1 MeV sector used for onset</li> <li>{sc}_e1MeV_peak_date: S/C electrons 1 MeV peak date [UTC]</li> <li>{sc}_e1MeV_peak_time: S/C electrons 1 MeV peak time [UTC]</li> <li>{sc}_e1MeV_peak_time_formatted: S/C electrons 1 MeV peak time [UTC] (Formatted)</li> <li>{sc}_e1MeV_peak_flux: S/C electrons 1 MeV original peak flux [cm^-2 s^-1 sr^-1 MeV^-1]</li> <li>{sc}_e1MeV_peak_flux_formatted: S/C electrons 1 MeV original peak flux [cm^-2 s^-1 sr^-1 MeV^-1] (Formatted)</li> <li>{sc}_e1MeV_peak_averaging: S/C electrons 1 MeV averaging used for peak [min]</li> <li>{sc}_e1MeV_peak_sector: S/C electrons 1 MeV sector used for peak</li> <li>{sc}_e1MeV_injection_date: S/C electrons 1 MeV inferred injection date [UTC]</li> <li>{sc}_e1MeV_injection_time: S/C electrons 1 MeV inferred injection time [UTC]</li> <li>{sc}_e1MeV_sw_speed: S/C electrons 1 MeV onset solar wind speed [km/s]</li> <li>{sc}_e1MeV_comments: S/C electrons 1 MeV comments</li> <li>{sc}_ep_ratio: Ratio of Electrons (~1MeV) / Protons (25-40 MeV)</li> </ul> </li> <li>CME related descriptions <ul> <li>cme_id: CME ID</li> <li>L1_date: Date of CME identification at L1</li> <li>L1_time: Time of CME identification at L1</li> <li>L1_pos_speed: Plane of sky speed of CME measured at L1</li> </ul> </li> </ul> <div><strong>CHANGELOG:</strong></div> <div> <ul> <li>2025-06-12 <ul> <li>Updated peak fluxes and peak times of PSP 1 MeV electrons, as well as PSP's e/p ratios (the previous flux values are erroneous!)</li> </ul> </li> </ul> </div>
Cryo-4D-STEM datasets on cells and cellular organelles for demonstrating a dose-Efficient cryo-EM technique: tilt-Corrected Scanning Transmission Electron Microscopy
<p>This upload contains three 4D-STEM datasets in .raw format for demonstrating a dose-efficient cryo-EM technique for thick samples: tilt-corrected Scanning Transmission Electron Microscopy (tcBF-STEM). The dataset dimension is 128130256*256. Data were acquired on vitrified intact E.coli cells and isolated human cell organelles. This upload also contains the EFTEM images in .mrc acqired in the same ROI as the 4D-STEM dataset. </p> <p>It also contains analysis of the manuscript's Fig 3 and Ext. data fig 8. </p>
Observation of an Exotic Insulator to Insulator Transition upon Electron Doping the Mott Insulator CeMnAsO
<p>VASP input and output for the computational part of the paper "Observation of an Exotic Insulator to Insulator Transition upon Electron Doping the Mott Insulator CeMnAsO".</p><p>stoichiometric.tar.gz: Data for stoichiometric CeMnAsO<br>defective.tar.gz: Data for CeMnAsO0.94F0.06</p>
Data for "Impact of Ligand Substitution and Metal Node Exchange in the Electronic Properties of Scandium Terephthalate Frameworks"
<p>The AiiDA archives of the high-throughput calculations presented in the paper "Impact of Ligand Substitution and Metal Node Exchange in the Electronic Properties of Scandium Terephthalate Frameworks".</p><p>The file "MOF_workflows.aiida" contains the actual calculation data and the files with suffix "*.yaml" contain configuration files of the workflows.</p>
Fig. 3 in Sensory Structures On The Antenniform Legs Of Whip Spider Phrynichus Phipsoni (Arachnida, Amblypygi) From The Indian State Of Goa: Scanning Electron Microscopic Elucidation
Fig. 3. Sensory assembly on the whip (Antenniform leg) of Phrynichus phipsoni from Goa, India: 8 — rod sensilla within groove, 9 — plate organ, 10 — slit sensilla, 11 — trichobothria, 12 — sockets of trichobothria
Fig. 1 in Sensory Structures On The Antenniform Legs Of Whip Spider Phrynichus Phipsoni (Arachnida, Amblypygi) From The Indian State Of Goa: Scanning Electron Microscopic Elucidation
Fig. 1. Resting captive specimen of whip spider Phrynichus phipsoni (Pocock, 1894). Note the whip like configuration, position, and length of the antenniform first pair of non-ambulatory leg. The various segments have been marked for reference: 1 — vertically raised femur; 2 — femur-patella-tibia joint; 3 — tibia; 4 — tibio-tarsal articulation; 5 — tarsus; 6 — distal tarsal tip.
Fig. 2 in Sensory Structures On The Antenniform Legs Of Whip Spider Phrynichus Phipsoni (Arachnida, Amblypygi) From The Indian State Of Goa: Scanning Electron Microscopic Elucidation
Fig. 2. Sensory assembly on the whip (Antenniform leg) of Phrynichus phipsoni from Goa, India: 1 — terminal tarsal claw; 2 — bristles; 3 — leaf like sensilla; 4 — pore sensilla; 5 — club sensilla; 6 — tarsal organ; 7 — pit organ.
Data Sets "Living Kombucha Electronics with Proteinoids"
<p>The data presents the electrical oscillations observed in Kombucha-proteinoid solutions with compositions of 40:60% (v/v) and 25:75% (v/v). </p>
Radiofrequency to Microwave Coherent Manipulation of an Organometallic Electronic Spin Qubit Coupled to a Nuclear Qudit
<p>Dataset containing ASCII files for Figures 2-8 of the paper </p><p>Radiofrequency to Microwave Coherent Manipulation of an Organometallic Electronic Spin Qubit Coupled to a Nuclear Qudit</p><p>Inorg. Chem. 2021, 60, 11273−11286</p>
Metal on Ceramic Friction Surfacing Data for Printing Electronics
<p>This repository is for data for an upcoming paper that presents work using micro friction surfacing for applying in-situ maskless metallizations and robust seed layers for electroless plating on demand to substrates like, aluminum oxide, aluminum nitride, and as fired LTCC, for fabrication of next generation power module and other high reliability electronic substrates. </p> <p>An adjoining youtube playlist, with unique video identifiers that correspond to data in the provided excel data sheets, of all raw video footage of the friction surfacing process can be found <a title="Metal on Ceramic Friction Surfacing playlist" href="https://youtube.com/playlist?list=PLxlbqMdRe6OVbtT3ehHzCJgsyfsY8-2mJ&si=QhrZ0YftJCpKQ3uq" target="_blank" rel="noopener">here:</a><br><br></p> <p>New generation power modules provide compact form factors while achieving multi kilovolt drive potentials at kiloamp currents.[1] However, their typical packaging and substrate metallization methods, such as thick film, direct bond copper, and active metal braze, limits attachment options and other manufacturing process requirements while incurring large processing costs and extended lead times for researchers and industry.[2]–[5] High speed micro friction surfacing allows for directly writing pure metal conductors and integrated passives, onto common insulating high reliability electronics substrates, supports additional layers of metallization and provides direct device interconnect before or after die fabrication and bonding, without bulk thermal annealing and without damaging the underlying substrate. Thus, making the next generation of power devices more tenable at the prototype level, and with further process refinements, at industrial scale.[6]–[13] This work highlights the importance of rapid and flexible prototyping for next generation power modules and high reliability electronics, and how finding new ways to use existing tooling can enhance fabrication options and potentially shore up semiconductor prototyping supply chain stability</p> <h2>1. Introduction</h2> <p>Current generation power modules and high-reliability electronics require rapid and flexible prototyping, but current fabrication methods using thin and thick film, ultrasonic soldering, direct oxide bonding and active metal brazing, have limitations due to exotic interface metallization, atmosphere control, and thermal cycling requirements during fabrication and deployment [2], [3], [5]. These limitations particularly apply to silicon carbide devices, where typical wire bondable aluminum, active metal brazed gold-titanium and direct bond copper substrate metallization schemes incur large fabrication costs and lead times while inhibiting rework of as fabricated substrates due to deep vacuum/ high temperature requirements and a substantial need for skilled manual labor [14], [15]. </p> <p>In this work, High Speed Micro-Friction Surfacing(HSMFS) is used to metallize substrates of aluminum oxide, aluminum nitride, and as fired LTCC, with millimetric to sub-millimeter, traces made of, copper, and gold. HSMFS enables relatively automated, single step fabrication of single layer electronic circuits with bond strengths that exceed thin and thick film methods and ultrasonic soldering, at a cost and lead time 20-50X less, without need for skilled labor. HSMFS is a downscaled extension of a broader class of methods known as "friction surfacing" wherein a rod or powder of a material to be coated onto a substrate, is stirred by rotating a tool, or "mechtrode" against the substrate, trapping the material to be deposited between the mechtrode and substrate surfaces.[1]–[3] The mechtrode can be either a wire of material that is consumed as deposition proceeds, or a non-consumable tool made of a hard material that resists wear during deposition. Heat is generated due to friction between mechtrode and substrate, and forging pressure is applied from a CNC motion platform. The combination of heat from friction, mechano-chemical activation, and forging pressure induced plastic deformation results in the shearing, viscoplastic flow and chemical and mechanical bonding of material from the mechtrode to the substrate being coated. </p> <p>While there have been previous examples of friction surfacing metals onto ceramic substrates[4], [5], none have been used in electronics applications, and no characterization of relevant electro-thermal properties and endurance has been carried out. Additionally, the typically centimeter or larger deposit size scale of the mechtrode and consequently large supporting machinery in previous work has meant that the technique would be unsuitable for fabricating modern electronics. This large mechtrode scale results in excessive, evolved heat at the interface and thus high probability of heat shock damage to ceramic materials. Further, the relatively low mechtrode rotational speeds used in most prior works, results in very high forging pressures (hundreds of MPa), which typically far exceed the fracture toughness of common ceramic substrates. We have overcome these limitations and managed to obtain near bulk metallic electronic properties in as deposited track widths as small as 0.5mm, and metallization thicknesses from nanometers to 10's of microns on frangible substrates without damaging the substrate or compromising its electro-thermo-mechanical endurance. </p> <h2>2. Materials and Methods</h2> <p> </p> <h2>2.1 Materials and tools</h2> <p>For this study the raw materials used to produce the printed prototype as fired circuits were provided by Tommy's Watch and Jewelry via Stuller Precious Metals, (1.6mm copper, #43-6421:100000:T and 0.6mm gold wire, #WIRE:9698:P) and The University of Arkansas High Density Electronics Center (HiDEC), (Dupont 1mm thick 951 LTCC, Stellar Industries 0.5mm thick 99% aluminum nitride, and 0.5mm thick 96% alumina ceramics). </p> <p>The process parameters for printing tracks of copper and gold on the three substrates of interest were explored using a genmitsu 1610 minimill with a Dremel "multipro" 30,000 RPM rotary tool as it's spindle, and a 26 gauge 1070 spring steel sheet covering the mill bed between the aluminum t-slotbed and the ceramic substrate being printed on, purchased on amazon. Each substrated was held in place with a set of binder clips to keep it firmly in position nad flat against the spring steel sheet during deposition. Each deposition process was recorded in thermal video(Flir-T300) (courtesy of Dr. Darin Nutter) with a microscope camera(Opti-Tekscope OT-HD) and in real time macro video (Nikon D750). Subsequent profilometry (Dektak3030) electrical resistance (Fluke 77), current handling testing, taklife and ACS723 current sensor, and Flir-T300 camera (courtesy of Dr. Darin Nutter), and film strength (Kapton pull tests) measurements were performed with tooling available at HiDEC. <br>Temperature data were extraced via optical character recognition using the script here:<br>https://github.com/mahydraal/OCRDataExtractor<br>it deploys tesseract OCR and relatively simple python script with tkinter to provide a graphical user interface to select a region of a video, scrub it for noise, convert it to black and white, and then read character data from the user selected region. </p> <h2>2.2 Determination of printing parameters</h2> <p>Metals, copper and gold, were deposited on substrates of 96% alumina, 99% aluminum nitride(Al-N) and fired 951 LTCC, from wires of 1.6mm and 0.6mm OD respectively, via high speed micro friction surfacing (HSMFS). Spindle RPM was set open-loop constant to 30K RPM, and surface feed velocity was varied between 15, 45 and 75 mm/minute at a constant ratio of X-Z feed distance of 80 to approximate a constant normal force at the stall torque of the Z axis motor of the motion frame in open loop mode. Each surface feed velocity set point was tested 3 times for each metal substrate combination. Each metal and substrate combination were cleaned with 90% IPA and 90% Acetone and Di rinsed then blown dry with nitrogen before deposition.</p> <p>Friction surfacing is a solid-state joining process that involves rubbing two surfaces together at high speeds under pressure, creating a bond between the two surfaces without melting them, stereotypically shown in figure. The process can be used to join similar or dissimilar metals and alloys, metals and ceramics, and organics, and is particularly useful for joining materials with high melting points, such as titanium and nickel-based alloys without obtaining fusion and melting temperatures and without protective atmosphere. This process generates significant waste heat from friction and plastic deformation, which is useful for monitoring and controlling deposition consistency, thus real time thermographic videos during each test were collected using a FLIR T-300 thermal camera, and optical character recognition on it's display to obtain insight into the deposition temperature trends at the substrate-feedstock interface and better tune the surface feed-velocity at constant RPM to obtain electronic continuity in the as deposited metallic tracks on each ceramic substrate type. Real time macro videography was performed on each test to provide post-facto analysis and record any anomalies that would not be representative of typical performance. </p> <p>An appropriate spindle speed for deposition must be selected as well as appropriate vertical and linear feeds and speeds for the mini mill in micro friction surfacing. This is generally due to the need for a specific surface energy threshold associated with frictional heating and mechanical surface activation to be obtained between the feedstock and the substrate. This surface energy must exceed the free energy of reaction for diffusion and bonding to occur between the atoms of the substrate and those of the feedstock. A list of energies of formation for various transition metal carbides and oxides, necessary for bonding of metals to carbide and nitride sub-states by friction surfacing is shown. </p> <p>In short, by controlling spindle speed surface feed rate, and providing a constant down force by constant Z-X feed rate ratio on the minimill, it is possible to set a constant rate of heat evolved at the friction interface between the feedstock and substrate. If this heat evolved exceeds the heat of formation of a bonding compound of interest for long enough, the reaction of interest can proceed and a tenacious bond between metal and substrate can form. The details of accurately modeling heat evolved in friction surfacing, given the details of a specific deposition system and feed stock geometry are elucidated well elsewhere, [29], [30] so we will not go into them here. The primary point being that one can approximate appropriate deposition parameters for almost any material combination, knowing the free energy of formation of an appropriate bonding phase, and or the pressure-temperature phase diagram for the material pair of interest.</p> <h2>2.3 Characterization and measurement of test films</h2> <p>Bond strength of the HSMFS deposited films of copper and gold were tested initially by simple kapton tape pull testing, thereby assigning a minimum failure stress on film bond strengths. Temperature trends recorded during the deposition via thermography were correlated with resultant film resistivities and average height profiles and cycling performance for each set of parameters, each metal and each substrate; the most consistent and robust parametrization results were used in subsequent experiments to fabricate basic current carrying tracks with a mix of soldered and wire bonded terminals to demonstrate feasibility of HSMFS for rapid prototyping of electronics. </p> <h3>2.3.1 Electrical resistivity extraction and profilometry</h3> <p>Each material deposition was followed by profilometry (Dektak3030) at 3 points along each track, averaging the resultant maximum heights to determine film thickness and calculate sheet resistivity from resistance measurements on the multimeter(Fluke 77).</p> <h3>2.3.2 Maximum ampacity testing</h3> <p>Each printed specimen was terminated with copper tape, and soldered/wire bonded respectively. A taklife DC benchtop power supply was used to supply DC 31 volt power at up to 11 amps of current. An Arduino and high current shunt resistor current sensor measured the current flowing through the printed track, and acted to provide automatic control of current ramp up time. The current through the printed track was stepped up by the Arduino in steps of 25 milliamps every 60 seconds to provide time for thermal equilibration and avoid substrate fracture. This process continued until the track failed due to shorting, thermal breakdown, or electromigration failure. </p>
Beating-free quantum oscillations in 2D electron gases with strong spin-orbit and Zeeman interactions
<p>Datafiles for figures in the paper:</p> <p><em>"Beating-free quantum oscillations in 2D electron gases with strong spin-orbit and Zeeman interactions"</em>, Phys. Rev. Research [<em>Accepted</em>]</p> <p>The datafiles relate to Figs. 2, 3, 10, 12, 14, 15, 16, and 17</p> <p>Figs. 1 and 13 contain schematics.</p> <p>Figs, 4, 6, and 8 are generated in a straightforwd manner using Eqs. (27), (34), and (40), respectively, using parameter values supplied in the figure captions.</p> <p>Fig. 5, is generated by Eq. (30) along with Eq. (29), using parameter values supplied in the figure captions.</p> <p>Fig. 7, is generated by Eq. (30) along with Eqs. (35) and (36), using parameter values supplied in the figure captions.</p> <p>Fig. 9, is generated by Eq. (30) along with Eqs. (41) and (42), using parameter values supplied in the figure captions.</p>
Experimental data for "Exact inversion of partially coherent dynamical electron scattering for picometric structure retrieval"
Open the record for dataset details and reuse information.
Dataset for A Statistical Survey of E-region Anomalous Electron Heating Using Poker Flat Incoherent Scatter Radar Observations
<p>This archive contains the complete list of anomalous electron heating (AEH) events in PFISR data between 2010 and 2023 identified by Zhang and Varney (2024), along with the code necessary to reproduce the results. The main list of AEH events is in the file AEH_event_list.csv, and the rest of this archive is supporting information for reproducibility.</p> <p>The files contained are:</p> <p>algo1.ipynb: Python notebook implementing algorithm 1.</p> <p>algo2.py: Python script implementing algorithm 2.</p> <p>algo3.ipynb: Python notebook implementing algorithm 3.</p> <p>algo4.ipynb: Python notebook implementing algorithm 4.</p> <p>cal_velo.py: Python function to calculate ion velocity.</p> <p>io_utils.py: Python functions for manipulating AMISR hdf5 files.</p> <p>Fig1.ipynb: Python notebook to recreate figure 1.</p> <p>Fig2,5.ipynb: Python notebook to recreate figures 2 and 5.</p> <p>Fig3,11.ipynb: Python notebook to recreate figures 3 and 11.</p> <p>Fig4.ipynb: Python notebook to recreate figure 4.</p> <p>Fig6.ipynb: Python notebook to recreate figure 6.</p> <p>Fig7,8,9,10.ipynb: Python notebook to recreate figures 7, 8, 9, and 10.</p> <p>PFISR_Data_Quality_Checker.ipynb: Python notebook with data preprocessing and quality checking.</p> <p>Table1.ipynb: Python notebook to extract the beamcode information needed for table 1.</p> <p>AEH_events_list.csv: Complete list of AEH events identified by algorithms 1, 3, and 4. The first column indicates the UT time of the start of the event, and 1 or 0 in the three columns denote whether the event was or was not detected by the algorithm, respectively.</p> <p>AEH_in_2010&2011.csv: Spreadsheet to facilitate direct comparisons with previous work on AEH in 2010 and 2011.</p> <p>f107.json: Smoothed F10.7 data used in this study.</p> <p>AEH_Detection_Outputs.zip: Archive of all of the raw output of the python scripts running the detection algorithms.</p> <p>AE&PAE.zip: Archive of all AE data used in this study.</p>
Bridging length scales in organic mixed ionic-electronic conductors through internal strain and mesoscale dynamics
<p>Understanding structural and dynamic properties of inherently disordered systems at the mesoscale is crucial. This is particularly important in organic mixed ionic-electronic conductors (OMIECs), which undergo significant and complex structural changes when operated in electrolyte. In this study, we investigate the mesoscale strain, reversibility, and dynamics of a model OMIEC material under external electrochemical potential using operando X-ray photon correlation spectroscopy. Our results reveal mesoscale strain and structural hysteresis that depend on the sample's cycling history, establishing a comprehensive kinetic sequence bridging the macroscopic and microscopic behaviors of OMIECs. Furthermore, we uncover equilibrium and non-equilibrium dynamics of charge carriers and material doping states, highlighting the unexpected coupling between charge carrier dynamics and mesoscale order. These findings advance our understanding of the structure-dynamics-function relationships in OMIECs, opening pathways for designing and engineering materials with improved performance and functionality in non-equilibrium states during device operation.</p>
Supplementary material for: Calibrating coordinate system alignment in a scanning transmission electron microscope using a digital twin.
<h1>Calibrating coordinate system alignment in a scanning transmission electron microscope using a digital twin.</h1> <h2>Supplementary material</h2> <p>This deposition contains supplementary material for a paper on coordinate system calibration in 4D STEM. A preprint of the paper is available at <a href="https://arxiv.org/abs/2403.08538">https://arxiv.org/abs/2403.08538</a>.</p> <h2>Contents</h2> <div> <div><code>20221025_154811.zip</code>: Overfocused 4D STEM test dataset</div> <div> </div> <div><code>overfocus.sif</code>: Apptainer image with complete software stack. <code>apptainer run --writable overfocus.sif</code> to execute. It starts a Jupyterlab instance with two notebooks, one to genreate test data and the other to perform the interactive adjustment. This documents the software version that was used for the figures in the paper.</div> <div> </div> <div><code>requirements.txt</code>: Python package versions of dependencies in <code>overfocus.sif</code>. </div> <div> </div> <div><code>COM - Jupyter Notebook - Google Chrome 2023-01-25 12-40-07_processed.mp4</code>: Screen capture video with explanation of the first live calibration with an early prototype.</div> <div> </div> <div><code>video description.docx</code>: Explanation of the plots and adjustment process in the screen capture video.</div> <div> </div> <div><code>Microscope-Calibration.tar.gz</code>: Repository archive of the software and examples for calibration in the version used in the paper.</div> <div> </div> <div><code>TemGym.tar.gz</code>: Repository archive of TemGym Basic in the version used in the paper.</div> </div>
ScienceDex guides
Understand access before you commit
These curated guides explain access requirements, typical timelines, costs, and reuse considerations for widely used research datasets.
Allen Brain Atlas
Allen Brain Atlas is an Allen Institute collection of brain map atlases, datasets, APIs, and analysis tools covering mouse, human, and non-human primate brain resources.
Annotated Behaviour and Observability Dataset (ABODe)
ABODe is a University of Edinburgh DataShare dataset for behavior classification in group-housed mice using home-cage video, identities, bounding boxes, ground-plate positions, and annotator labels.
DANDI Archive for NWB datasets
DANDI is a BRAIN Initiative archive for publishing and sharing neurophysiology data, including electrophysiology, optophysiology, and behavioral data packaged as NWB and related standards.
International Brain Laboratory public data
The International Brain Laboratory public data releases expose standardized mouse decision-making experiments, including Neuropixels recordings, widefield calcium imaging, behavior, and session metadata accessed through the ONE API.
OpenNeuro
OpenNeuro is a free, open platform for sharing neuroimaging datasets, with public search, dataset pages, and download paths for web, S3, DataLad, and the OpenNeuro CLI.