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Lap-shear testing bondrig design

<p>These files comprise of the design of a bondrig, used to bond multiple lap-shear samples in a single lay-up. The assembly file illustrates one method of fixing the bonded samples.&nbsp;As can be seen from the CAD image in the pdf, the bond overlap length was controlled at 12.7 mm as per ASTM D1002-10. The rig is designed for standard lap shear coupons with a length&nbsp;of 101.6 mm; once two samples are aligned at either edge of the bondrig (+<em>x</em> and &ndash;<em>x</em> edges) an&nbsp;overlap length of&nbsp;12.7 mm will be achieved. As can be seen in the pdf, the top level was 1.92 mm higher than the bottom level. This gave a bond-line thickness of 0.3 mm when taking into account the thickness of the lap shear samples (1.62 mm).&nbsp;</p> <p>Two options are available for fixing the samples after lay-up, prior to curing (see Image 1).</p> <p>a. Fix the three cross-clamps across the samples as indicated in the assembly drawing</p> <p>b. Stack&nbsp;three cross-clamp bars and rest on the upper set of samples with the front edge in-line with the start of the step in the mounting plate; stack and place two cross-clamp bars as close to the overlap edge but avoid placing on the adhesive&nbsp;</p> <p>It has been shown that Method (b) is more effective at ensuring consistent bondline thickness within joints and is the recommended approach. A fluoropolymer release coating has been applied to this bondrig to remove fouling of the adhesive on the surface. This has been applied using to the CoBlast process. See www.enbio.eu for more information.&nbsp;</p>