SU-8 2000 Series Negative Photoresist
SU-8 2000 Series chemically amplified negative photoresist for high-aspect-ratio photolithography. Available in Low (0.5–15 μm), Medium (25–170 μm), and High (60–260 μm) viscosity grades. 500 mL bottles, 5/10/25-pack options. For MEMS, microfluidi...
| Resist Type | Negative, Chemically Amplified |
| Solvent | Cyclopentanone |
| Exposure Wavelength | 365 nm (i-line) |
| Developer | PGMEA |
| Resin | Bisphenol A Novolac Epoxy (EPON SU-8) |
| Bottle Size | 500 mL amber glass |
SU-8 2000 Series Negative Photoresist
The SU-8 2000 series is a chemically amplified, epoxy-based negative photoresist developed for high-aspect-ratio photolithography. The series spans film thicknesses from sub-micron to 250+ μm across three viscosity tiers, all compatible with standard i-line (365 nm) exposure equipment.
Originally developed by MicroChem (now Kayaku Advanced Materials).
Choose Your Formulation
| Viscosity Grade | Film Thickness | Formulations | Best For |
|---|---|---|---|
| Low | 0.5–15 μm | SU-8 2000.5, 2002, 2005, 2007, 2010, 2015 | Thin-film MEMS, sensors, optics |
| Medium | 25–170 μm | SU-8 2025, 2035, 2050 | Microfluidic channels, BioMEMS |
| High | 60–260 μm | SU-8 2075, 2100 | Thick MEMS, PDMS molds, electroplating |
Common Specifications
| Resist Type | Negative, chemically amplified |
| Resin | Bisphenol A Novolac epoxy (EPON SU-8) |
| Solvent | Cyclopentanone |
| Exposure Wavelength | 365 nm (i-line), 350–400 nm range |
| Developer | PGMEA (1-methoxy-2-propanol acetate) |
| Aspect Ratio | >20:1 with standard contact lithography |
| Bottle Size | 500 mL amber glass |
Processing Overview
| Step | Parameters |
|---|---|
| Spin Coating | 500–4,000 rpm (formulation- and thickness-dependent) |
| Soft Bake | 65°C → ramp to 95°C (time scales with thickness) |
| Exposure | 100–400 mJ/cm² at 365 nm; split exposures for thick films |
| Post-Exposure Bake | 65°C → ramp to 95°C |
| Development | PGMEA immersion, ~1 min per 20 μm thickness |
Applications
- Microfluidics — Channel molds, lab-on-a-chip devices, PDMS soft lithography masters
- MEMS — Structural layers, actuators, sensors, electroplating molds
- Photolithography — Thin- and thick-film patterning with high aspect ratios
- Bio-MEMS — Biocompatible structural material for implantable devices
- Optical Waveguides — Excellent transparency above 360 nm
Key Advantages
- Near-vertical sidewalls with aspect ratios exceeding 20:1
- Low absorption in near-UV range enables uniform exposure through thick films
- Excellent chemical resistance and thermal stability post-crosslink
- Non-conductive — usable directly as insulator in electroplating processes
Need a Specific Formulation?
Select your viscosity grade and pack size above. If you need a specific SU-8 2000 formulation (e.g., SU-8 2050) within a tier, mention it in your order notes or contact us for guidance.
Resist Type
- Negative, Chemically Amplified
Solvent
- Cyclopentanone
Exposure Wavelength
- 365 nm (i-line)
Developer
- PGMEA
Resin
- Bisphenol A Novolac Epoxy (EPON SU-8)
Viscosity Grade
- Low (0.5–15 μm)
- Medium (25–170 μm)
- High (60–260 μm)
Pack Size
- 5 × 500 mL
- 10 × 500 mL
- 25 × 500 mL
Bottle Size
- 500 mL amber glass
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