Photosensitive Glass Substrate (High Aspect Ratio) — 25-Pack
Pack of 25.
Photosensitive glass that forms high-aspect-ratio channels and through-holes after UV exposure, heat treatment and etching, with no photoresist. Aspect ratio over 10:1.
Louise Corscadden, PhD
Director of Science · ConductScience
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Key Specifications
Full details →- Model fit
- Configured during quote
- SKU family
- WHM-0168-25PK
- Shipping box
- 181.8 × 136.3 × 90.9 cm
- Ordering
- Online checkout and quote request available
- Category
- Lab Equipment
- Build notes
- Confirm accessories, station layout, and support needs before purchase
This photosensitive glass is made by continuous melting for uniform photosensitivity. After UV exposure and heat treatment, crystals form in the exposed areas, and acid etching removes them to leave fine high-aspect-ratio structures and through-holes. A second exposure and heat treatment turns the glass into a glass-ceramic for extra strength. It is used for microfluidics, RF components and MEMS, and it cuts and bonds with conventional methods.
Specifications
- Aspect ratio: over 10:1
- Through-holes: from 35 µm diameter (in 0.5 mm glass)
- Minimum pitch: 45 µm
- Etch-rate ratio, treated to untreated: over 30:1
- Sidewall angle: over 88°
- Etched-surface roughness: under 3 µm
- Sizes: 6-, 8- and 12-inch wafers and 93 × 93 to 175 × 175 mm squares, 0.5–1.3 mm thick; custom sizes on request
- Transparent in the visible and beyond; EU RoHS and REACH compliant
Pack of 25.
Shipping weight
- 3.3 lb
Shipping box
- L: 181.8 cm
- W: 136.3 cm
- H: 90.9 cm
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