Vacuum Hot Press Bonding Machine
Vacuum hot press for bonding rigid plastic microfluidic chips (PMMA, PC, COC): up to 200 °C and 0–5 kN on a 230 × 200 mm aluminum platen, with air cooling.
Louise Corscadden, PhD
Director of Science · ConductScience
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Key Specifications
Full details →- Model fit
- Configured during quote
- SKU family
- WHM-0040
- Shipping box
- 500.0 × 400.0 × 600.0 cm
- Ordering
- Online checkout and quote request available
- Category
- Lab Equipment
- Build notes
- Confirm accessories, station layout, and support needs before purchase
The Vacuum Hot Press Bonding Machine bonds rigid plastic microfluidic chips such as PMMA, PC and COC. Constant-temperature heating gives precise control, the aluminum platens are flat and conduct heat evenly, and the heated area covers common chip sizes. Pressure is adjustable for each material, air cooling cools evenly, and vacuum hot pressing improves bonding without damaging the chip.
Specifications
- Working platen: 230 × 200 mm
- Chip thickness: 0–140 mm
- Pressure: 0–5 kN
- Maximum temperature: 200 °C
- Power: 220 V AC, 50 Hz, 1.4 kW
- Size: 470 × 415 × 876 mm
- Weight: 80 kg
Runs on 220 V AC, 50 Hz; US labs need a 220 V circuit.
Environment
- Vacuum
Automation Level
- semi-automated
Brand
- ConductScience
Research Domain
- Analytical Chemistry
- Cell Biology
- Clinical Diagnostics
- Materials Science
- Microbiology
- Pharmaceutical QC
Shipping weight
- 50.0 lb
Shipping box
- L: 500.0 cm
- W: 400.0 cm
- H: 600.0 cm
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