Electronics inspection
PCB and package inspection for missing, short, open, and contamination defects.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
What you get
The measurement, today
Board inspection for research and process development needs flexible defect detection without a fixed AOI program.
From image to reviewed result
- 1
Calibrate the scale
Set spatial scale from a bar or known dimension. Every downstream number inherits real units.
- 2
Detect & segment
Segmentation models find the objects and regions of interest: grains, particles, pores, fibers, cells.
- 3
Measure
Quantify size, count, area fraction, density, and orientation. The metrics your method already defines.
- 4
Review the overlay
Inspect the result on every field. Adjust thresholds by hand; the change is logged with the output.
- 5
Export & compare
Publication-ready statistics, plus batch comparison across lots, conditions, and time points.
Related applications
Semiconductor defect patterns
Classify wafer-map patterns and quantify defect clusters and densities.
Fiber optic end-face inspection
Count and grade scratches and defects by zone on a connector end-face, per IEC 61300-3-35.
Solder joint inspection
Joint-quality classification and void measurement for solder and bond images.
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
