Solder joint inspection
Joint-quality classification and void measurement for solder and bond images.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
The measurement, today
Solder voids and joint defects are inspected manually, which is slow and misses sub-surface voids in BGA joints.
From image to reviewed result
- 1
Calibrate the scale
Set spatial scale from a bar or known dimension. Every downstream number inherits real units.
- 2
Detect & segment
Segmentation models find the objects and regions of interest: grains, particles, pores, fibers, cells.
- 3
Measure
Quantify size, count, area fraction, density, and orientation. The metrics your method already defines.
- 4
Review the overlay
Inspect the result on every field. Adjust thresholds by hand; the change is logged with the output.
- 5
Export & compare
Publication-ready statistics, plus batch comparison across lots, conditions, and time points.
What you export
Related applications
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
