Advanced packaging: microbumps, TSVs & hybrid bonds
Inspect microbumps, through-silicon vias, bond interfaces, and package alignment from cross-section and nondestructive images.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
Image: Illustrative rendering (AI-generated, gpt-image-2), not an SEM image of a specific package
Results
Each measurement below comes from your own images, tied back to the annotated frame it came from, so results stay comparable across samples, locations, and conditions.
per area
Microbump geometry
Findings placed in sample coordinates to reveal spatial patterns and local density.
Example, not a claimed result
In your report: Coordinate-referenced map, regional density, and representative images.
% length
TSV / bond-interface findings
Length of interface meeting the agreed rule divided by the eligible interface length.
Example, not a claimed result
In your report: Continuity value, gap locations, and the rule version used to classify a gap.
% area
Void & delamination map
Segmented area of the feature divided by the eligible area in the two-dimensional image.
In your report: Per-field value, size distribution, and the segmentation overlay used.
per area
Alignment proxy
Findings placed in sample coordinates to reveal spatial patterns and local density.
Example, not a claimed result
In your report: Coordinate-referenced map, regional density, and representative images.
Built around your image set
Use the calibrated images your team already collects, together with the locations you need to compare.
Each report includes
The artifacts your team receives, ready for review and archive.
Annotated image set
Original images with regions of interest, measurement points, masks, and finding overlays.
Measurement table
Location-indexed values, units, distributions, and QC flags in a structured export.
Method record
Calibration evidence, analysis settings, version history, and validation summary.
Confidence in every resultTraceable measurements, reviewed against your agreed reference method.
- Traceable scale
- The report records the image scale, calibration evidence, and a method-specific expanded measurement uncertainty. It does not use one product-wide accuracy number.
- Reference comparison
- The configured method is compared with your accepted reference method or reviewed annotations, and reports bias by measurement range and image condition.
- Detection performance
- Detections are evaluated against reviewed reference regions with precision, recall, and segmentation overlap, separated by the conditions that affect performance.
- Repeatability
- The locked protocol is rerun on the same inputs and on a defined repeat set. The review records variation from image acquisition, sampling, and analysis separately where possible.
What this result does not establish: Measures features visible in supplied images. Package qualification, bond strength, and electrical continuity need the complementary reliability and electrical-test methods used by your program.
The measurement, today
Heterogeneous packages bring multiple interfaces into a small area. Engineers often switch between SEM, X-ray, and acoustic images without a shared finding list or overlay record.
What it costs
Bond and interconnect defects can appear only after later assembly or reliability work. A consistent image review helps retain the evidence from each package interface.
From image to reviewed result
- 1
Load package imagery
Provide calibrated SEM cross-sections, X-ray, or acoustic images of the interfaces under review.
- 2
Register the interfaces
Identify die, bump, via, bond, and substrate regions so measurements stay tied to package geometry.
- 3
Detect and measure
Flag visible voids, interconnect irregularities, alignment offsets, and interface discontinuities.
- 4
Export a review set
Create annotated images and an interface-level finding table for package or reliability review.
Not sure this is the right measurement?
Send a representative image and your measurement goal. A ConductVision scientist will confirm whether this is the right fit, or point you to the closer workflow, before you commit to a quote.
Related applications
X-ray package reliability inspection
Measure solder voids, missing or offset joints, wire-bond anomalies, and internal package features from X-ray imagery.
Solder joint inspection
Joint-quality classification and void measurement for solder and bond images.
Thin-film step coverage & uniformity
Quantify layer thickness and step coverage across planar and topographic semiconductor features.
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
