Advanced packaging: microbumps, TSVs & hybrid bonds
Inspect microbumps, through-silicon vias, bond interfaces, and package alignment from cross-section and nondestructive images.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
Image: Illustrative rendering (AI-generated, gpt-image-2), not an SEM image of a specific package
What you get
The measurement, today
Heterogeneous packages bring multiple interfaces into a small area. Engineers often switch between SEM, X-ray, and acoustic images without a shared finding list or overlay record.
What it costs
Bond and interconnect defects can appear only after later assembly or reliability work. A consistent image review helps retain the evidence from each package interface.
From image to reviewed result
- 1
Load package imagery
Provide calibrated SEM cross-sections, X-ray, or acoustic images of the interfaces under review.
- 2
Register the interfaces
Identify die, bump, via, bond, and substrate regions so measurements stay tied to package geometry.
- 3
Detect and measure
Flag visible voids, interconnect irregularities, alignment offsets, and interface discontinuities.
- 4
Export a review set
Create annotated images and an interface-level finding table for package or reliability review.
Scope: Measures features visible in supplied images. Package qualification, bond strength, and electrical continuity need the complementary reliability and electrical-test methods used by your program.
Related applications
X-ray package reliability inspection
Measure solder voids, missing or offset joints, wire-bond anomalies, and internal package features from X-ray imagery.
Solder joint inspection
Joint-quality classification and void measurement for solder and bond images.
Thin-film step coverage & uniformity
Quantify layer thickness and step coverage across planar and topographic semiconductor features.
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
