Thin-film step coverage & uniformity
Quantify layer thickness and step coverage across planar and topographic semiconductor features.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
Image: Illustrative rendering (AI-generated, gpt-image-2), not a cross-section of a specific device
What you get
The measurement, today
Film thickness is often reported as one number from a monitor wafer, while local coverage around steps, vias, and corners is inspected separately and qualitatively.
What it costs
Non-uniform coverage can affect isolation, barriers, contacts, and subsequent etch behavior. A spatial measurement set exposes where a stack departs from its intended geometry.
From image to reviewed result
- 1
Load the layer images
Provide calibrated cross-section or thickness-map images from the surfaces and topography under review.
- 2
Separate the stack
Trace each visible layer and the feature geometry beneath it.
- 3
Measure coverage
Compare local layer thickness at the top, sidewall, and bottom of configured features.
- 4
Export the profile
Review thickness distributions, minimum locations, and annotated cross-sections together.
Scope: Measures visible layer boundaries in supplied images. Material identity, optical-model choices, and calibrated thickness acceptance remain with your metrology method.
Related applications
Etch profile & high-aspect-ratio metrology
Measure trench width, depth, sidewall angle, bowing, taper, and bottom residue from cross-section images.
CMP scratch & planarization inspection
Locate scratches, residual particles, dishing, and erosion signatures after chemical mechanical planarization.
Coating thickness & porosity
Thickness profiles and sub-surface porosity from polished coating cross-sections.
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
