CMP scratch & planarization inspection
Locate scratches, residual particles, dishing, and erosion signatures after chemical mechanical planarization.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
Image: Illustrative rendering (AI-generated, gpt-image-2), not a photograph of a specific wafer
What you get
The measurement, today
CMP review is commonly a visual screen followed by manual annotation. Fine scratches and spatial trends can be hard to compare across pads, slurries, and lots.
What it costs
Planarization defects can carry into subsequent patterning and interconnect steps. Image-linked defect classes make a pad or consumable comparison easier to review.
From image to reviewed result
- 1
Load post-CMP images
Upload optical, darkfield, or profilometry images from the wafer locations under review.
- 2
Separate surface features
Detect linear scratches, particle-like features, and regions with a different planarization signature.
- 3
Measure the distribution
Record feature dimensions, affected area, and field or wafer position.
- 4
Review by lot or condition
Export annotated images and summary tables for pad, slurry, and process comparison.
Scope: Flags surface features visible to the supplied imaging modality. Dishing, erosion, and film thickness need a calibrated reference method before being used as process-release measurements.
Related applications
Wafer edge, bow & warp inspection
Locate edge chips and measure image-derived edge geometry before handling, lithography, or packaging.
Thin-film step coverage & uniformity
Quantify layer thickness and step coverage across planar and topographic semiconductor features.
Wafer defect map & binning
Detect, locate, size, and bin defects across a wafer into a spatial map.
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
