Wafer edge, bow & warp inspection
Locate edge chips and measure image-derived edge geometry before handling, lithography, or packaging.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
Image: Illustrative rendering (AI-generated, gpt-image-2), not a photograph of a specific wafer
What you get
The measurement, today
Edge damage and wafer geometry are often logged as separate pass/fail checks. The image evidence is not consistently retained, and a small edge chip can be missed until a handling or coating issue appears.
What it costs
Edge defects can seed breakage, handling failures, and exclusion-zone losses. Geometry trends are more useful when tied back to the actual wafer image and lot.
From image to reviewed result
- 1
Image the edge
Capture the edge and exclusion zone with your edge-inspection or optical-profilometry system.
- 2
Register the wafer
Align the edge image set to wafer coordinates so each finding keeps its angular location.
- 3
Measure findings
Segment chips and visible edge damage, then calculate the configured bow or warp profile from the supplied geometry images.
- 4
Export the record
Deliver an image-linked defect list and geometry summary for review.
Scope: Reports geometry from calibrated image or profilometry inputs. Use your qualified tool and site method for any handling, process, or acceptance limit.
Related applications
Silicon ingot & wafer quality
Review crystal-origin defects, surface particles, and saw damage before wafers enter the process flow.
Wafer defect map & binning
Detect, locate, size, and bin defects across a wafer into a spatial map.
CMP scratch & planarization inspection
Locate scratches, residual particles, dishing, and erosion signatures after chemical mechanical planarization.
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
