Silicon ingot & wafer quality
Review crystal-origin defects, surface particles, and saw damage before wafers enter the process flow.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
Image: Illustrative rendering (AI-generated, gpt-image-2), not a micrograph of a specific sample
Results
Each measurement below comes from your own images, tied back to the annotated frame it came from, so results stay comparable across samples, locations, and conditions.
per area
Defect location map
Findings placed in sample coordinates to reveal spatial patterns and local density.
In your report: Coordinate-referenced map, regional density, and representative images.
µm or count
Particle & chip count
Size and shape measured for every detected object, then summarized across the population.
Example, not a claimed result
In your report: Per-object table, size distribution, and summary percentiles.
class
Visible defect class
Each detected feature assigned to a class using the agreed rule set, shown on the image.
In your report: Per-feature class, counts by class, and annotated overlays.
% area
Surface coverage
Segmented area of the feature divided by the eligible area in the two-dimensional image.
Example, not a claimed result
In your report: Per-field value, size distribution, and the segmentation overlay used.
Built around your image set
Use the calibrated images your team already collects, together with the locations you need to compare.
Each report includes
The artifacts your team receives, ready for review and archive.
Annotated image set
Original images with regions of interest, measurement points, masks, and finding overlays.
Measurement table
Location-indexed values, units, distributions, and QC flags in a structured export.
Method record
Calibration evidence, analysis settings, version history, and validation summary.
Confidence in every resultTraceable measurements, reviewed against your agreed reference method.
- Traceable scale
- The report records the image scale, calibration evidence, and a method-specific expanded measurement uncertainty. It does not use one product-wide accuracy number.
- Reference comparison
- The configured method is compared with your accepted reference method or reviewed annotations, and reports bias by measurement range and image condition.
- Detection performance
- Detections are evaluated against reviewed reference regions with precision, recall, and segmentation overlap, separated by the conditions that affect performance.
- Repeatability
- The locked protocol is rerun on the same inputs and on a defined repeat set. The review records variation from image acquisition, sampling, and analysis separately where possible.
What this result does not establish: Measures features visible in supplied images. Crystal perfection, contamination chemistry, and material acceptance require the complementary metrology and qualification methods used by your site.
The measurement, today
Ingot and incoming-wafer review often reduces a large surface to a few manual fields. Small chips, particles, and visible crystal defects are recorded inconsistently, making supplier comparisons difficult.
What it costs
Material defects that enter the line can confound later process review. A retained image record makes the incoming condition visible when a downstream excursion needs to be traced.
From image to reviewed result
- 1
Capture the material
Load incoming-wafer, ingot, or surface images from the inspection method your group already uses.
- 2
Set the measurement scale
Use the instrument scale or a known reference so finding dimensions report in real units.
- 3
Review visible findings
Segment visible particles, chips, scratches, and crystal-origin features into a reviewable map.
- 4
Compare lots
Export image-linked counts and size distributions for lot-to-lot review.
Not sure this is the right measurement?
Send a representative image and your measurement goal. A ConductVision scientist will confirm whether this is the right fit, or point you to the closer workflow, before you commit to a quote.
Related applications
Wafer edge, bow & warp inspection
Locate edge chips and measure image-derived edge geometry before handling, lithography, or packaging.
Wafer defect map & binning
Detect, locate, size, and bin defects across a wafer into a spatial map.
CMP scratch & planarization inspection
Locate scratches, residual particles, dishing, and erosion signatures after chemical mechanical planarization.
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
