X-ray package reliability inspection
Measure solder voids, missing or offset joints, wire-bond anomalies, and internal package features from X-ray imagery.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
Image: Illustrative rendering (AI-generated, gpt-image-2), not an X-ray image of a specific package
Results
Each measurement below comes from your own images, tied back to the annotated frame it came from, so results stay comparable across samples, locations, and conditions.
% area
Void fraction by joint
Segmented area of the feature divided by the eligible area in the two-dimensional image.
Example, not a claimed result
In your report: Per-field value, size distribution, and the segmentation overlay used.
µm or count
Joint presence & offset
Size and shape measured for every detected object, then summarized across the population.
In your report: Per-object table, size distribution, and summary percentiles.
µm or count
Wire-bond / package findings
Size and shape measured for every detected object, then summarized across the population.
Example, not a claimed result
In your report: Per-object table, size distribution, and summary percentiles.
per area
Defect location map
Findings placed in sample coordinates to reveal spatial patterns and local density.
In your report: Coordinate-referenced map, regional density, and representative images.
Built around your image set
Use the calibrated images your team already collects, together with the locations you need to compare.
Each report includes
The artifacts your team receives, ready for review and archive.
Annotated image set
Original images with regions of interest, measurement points, masks, and finding overlays.
Measurement table
Location-indexed values, units, distributions, and QC flags in a structured export.
Method record
Calibration evidence, analysis settings, version history, and validation summary.
Confidence in every resultTraceable measurements, reviewed against your agreed reference method.
- Traceable scale
- The report records the image scale, calibration evidence, and a method-specific expanded measurement uncertainty. It does not use one product-wide accuracy number.
- Reference comparison
- The configured method is compared with your accepted reference method or reviewed annotations, and reports bias by measurement range and image condition.
- Detection performance
- Detections are evaluated against reviewed reference regions with precision, recall, and segmentation overlap, separated by the conditions that affect performance.
- Repeatability
- The locked protocol is rerun on the same inputs and on a defined repeat set. The review records variation from image acquisition, sampling, and analysis separately where possible.
What this result does not establish: Quantifies image-visible internal features. X-ray contrast, projection geometry, and validated site criteria determine what can be resolved and how it should be dispositioned.
The measurement, today
X-ray review of BGA and flip-chip packages can be a high-volume visual screen. Subsurface voids and offsets are difficult to summarize consistently across assemblies and lots.
What it costs
Internal package defects may not be visible externally, yet they can influence assembly yield and reliability investigation. Image-linked measurements keep the defect evidence reviewable.
From image to reviewed result
- 1
Load the radiographs
Upload 2D X-ray, CT-slice, or matched cross-section images for the package population.
- 2
Locate the interconnects
Register solder joints, package regions, or wire-bond areas using the configured package template.
- 3
Quantify visible findings
Measure void area, joint geometry proxies, offsets, and other visible internal discontinuities.
- 4
Review by assembly
Export per-package findings with the original and annotated radiographs.
Not sure this is the right measurement?
Send a representative image and your measurement goal. A ConductVision scientist will confirm whether this is the right fit, or point you to the closer workflow, before you commit to a quote.
Related applications
Advanced packaging: microbumps, TSVs & hybrid bonds
Inspect microbumps, through-silicon vias, bond interfaces, and package alignment from cross-section and nondestructive images.
Solder joint inspection
Joint-quality classification and void measurement for solder and bond images.
Electronics inspection
PCB and package inspection for missing, short, open, and contamination defects.
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
