X-ray package reliability inspection
Measure solder voids, missing or offset joints, wire-bond anomalies, and internal package features from X-ray imagery.
Example outputs shown for illustration. Numbers depend on your samples and protocol.
Image: Illustrative rendering (AI-generated, gpt-image-2), not an X-ray image of a specific package
What you get
The measurement, today
X-ray review of BGA and flip-chip packages can be a high-volume visual screen. Subsurface voids and offsets are difficult to summarize consistently across assemblies and lots.
What it costs
Internal package defects may not be visible externally, yet they can influence assembly yield and reliability investigation. Image-linked measurements keep the defect evidence reviewable.
From image to reviewed result
- 1
Load the radiographs
Upload 2D X-ray, CT-slice, or matched cross-section images for the package population.
- 2
Locate the interconnects
Register solder joints, package regions, or wire-bond areas using the configured package template.
- 3
Quantify visible findings
Measure void area, joint geometry proxies, offsets, and other visible internal discontinuities.
- 4
Review by assembly
Export per-package findings with the original and annotated radiographs.
Scope: Quantifies image-visible internal features. X-ray contrast, projection geometry, and validated site criteria determine what can be resolved and how it should be dispositioned.
Related applications
Advanced packaging: microbumps, TSVs & hybrid bonds
Inspect microbumps, through-silicon vias, bond interfaces, and package alignment from cross-section and nondestructive images.
Solder joint inspection
Joint-quality classification and void measurement for solder and bond images.
Electronics inspection
PCB and package inspection for missing, short, open, and contamination defects.
Send a sample image and a measurement goal
We will show the closest ConductVision workflow and flag what needs custom validation for your images.
